Package structure and method of manufacturing the same

ABSTRACT

A package structure and a method of forming the same are provided. The package structure includes a first die and a second die, a first encapsulant, a second encapsulant and a RDL structure. The first die includes a first connector and a first protection layer covering sidewalls of the first connector, and the second die includes a second connector. The first encapsulant is at least disposed laterally between the first die and the second die to encapsulate first sidewalls of the first die and the second die that faces each other. The second encapsulant encapsulates second sidewalls of the first die and the second die. The RDL structure is disposed on and electrically connected to the first die and the second die. The top surfaces of the first protection layer, the first encapsulant, and the second encapsulant are in contact with a bottom surface of the RDL structure.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of and claims the priority benefit of a prior application Ser. No. 15/835,466, filed on Dec. 08, 2017, now allowed. The prior application Ser. No. 15/835,466 claims the priority benefit of U.S. provisional application Ser. No. 62/584,914, filed on Nov. 13, 2017. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

The semiconductor industry has experienced rapid growth due to continuous improvements in the integration density of various electronic components (i.e., transistors, diodes, resistors, capacitors, etc.). For the most part, this improvement in integration density has come from continuous reductions in minimum feature size, which allows more of the smaller components to be integrated into a given area. These smaller electronic components also require smaller packages that utilize less area than previous packages. Some smaller types of packages for semiconductor components include quad flat packages (QFPs), pin grid array (PGA) packages, ball grid array (BGA) packages, and so on.

Currently, integrated fan-out packages are becoming increasingly popular for their compactness.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A to FIG. 1F are schematic cross-sectional views illustrating a method of forming a package structure according to a first embodiment of the disclosure.

FIG. 2A to FIG. 2F are schematic cross-sectional views illustrating a method of forming a package structure according to a second embodiment of the disclosure.

FIG. 3A to FIG. 3F are schematic cross-sectional views illustrating a method of forming a package structure according to a third embodiment of the disclosure.

FIG. 4 is a schematic cross-sectional view illustrating a package structure according to some embodiments of the disclosure.

FIG. 5 is a schematic cross-sectional view illustrating a package structure according to some embodiments of the disclosure.

FIG. 6 is a flow chart illustrating a method of forming a package structure according to some embodiments of the disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a second feature over or on a first feature in the description that follows may include embodiments in which the second and first features are formed in direct contact, and may also include embodiments in which additional features may be formed between the second and first features, such that the second and first features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath”, “below”, “lower”, “on”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the FIG.s. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the FIG.s. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

Other features and processes may also be included. For example, testing structures may be included to aid in the verification testing of the 3D packaging or 3DIC devices. The testing structures may include, for example, test pads formed in a redistribution layer or on a substrate that allows the testing of the 3D packaging or 3DIC, the use of probes and/or probe cards, and the like. The verification testing may be performed on intermediate structures as well as the final structure. Additionally, the structures and methods disclosed herein may be used in conjunction with testing methodologies that incorporate intermediate verification of known good dies to increase the yield and decrease costs.

FIG. 1A to FIG. 1F are schematic cross-sectional views illustrating a forming method of a package structure according to a first embodiment of the disclosure.

Referring to FIG. 1A, a carrier 10 is provided. The carrier 10 may be a glass carrier, a ceramic carrier, or the like. In some embodiments, the carrier 10 has a de-bonding layer 11 formed thereon. The de-bonding layer 11 is formed by, for example, a spin coating method. In some embodiments, the de-bonding layer 11 may be formed of an adhesive such as an Ultra-Violet (UV) glue, a Light-to-Heat Conversion (LTHC) glue, or the like, or other types of adhesives. The de-bonding layer 11 is decomposable under the heat of light to thereby release the carrier 10 from the overlying structures that will be formed in subsequent steps.

In some embodiments, a die 120 a and a die 20 b are attached side by side to the de-bonding layer 11 over the carrier 10 through an adhesive layer 12 such as a die attach film (DAF), silver paste, or the like. The die 120 a and the die 20 b may respectively be an application-specific integrated circuit (ASIC) chip, an analog chip, a sensor chip, a wireless and radio frequency chip, a voltage regulator chip, a memory chip or the like. The die 120 a and the die 20 b may be the same types of dies or the different types of dies. In some embodiments, the two dies 120 a and 20 b are two small die partitions with different function of a larger single die. The size (refers to the height and/or the width) of the two dies 120 a and 20 b may be the same or different. In some embodiments, a gap 21 is existed between the two dies 120 a and 20 b. The number of the dies attached to the carrier 10 is not limited to that is shown in FIG. 1A. In some other embodiments, one die or more than two dies are attached to the carrier 10.

In some embodiments, the two dies 120 a and 20 b have similar structures. For the sake of brevity, the die 120 a is taken for example. The die 120 a includes a substrate 13 a, a pad 14 a, a passivation layer 15 a, conductive posts 19 a and a protection layer 18 a.

In some embodiments, the substrate 13 is made of silicon or other semiconductor materials. Alternatively or additionally, the substrate 13 includes other elementary semiconductor materials such as germanium, gallium arsenic, or other suitable semiconductor materials. In some embodiments, the substrate 13 may further include other features such as various doped regions, a buried layer, and/or an epitaxy layer. Moreover, in some embodiments, the substrate 13 is made of an alloy semiconductor such as silicon germanium, silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide. Furthermore, the substrate 13 may be a semiconductor on insulator such as silicon on insulator (SOI) or silicon on sapphire.

The pads 14 a may be a part of an interconnection structure (not shown) and electrically connected to the devices (not shown) formed on the substrate 13 a. In some embodiments, the devices may be active devices, passive devices, or a combination thereof. In some embodiments, the devices are integrated circuit devices. The passivation layer 15 a is formed over the substrate 13 a and covers a portion of the pads 14 a. A portion of the pads 14 a is exposed by the passivation layer 15 a and serves as an external connection of the die 120 a. In some embodiments, the passivation layer 15 a includes a first passivation layer 8 a and a second passivation layer 9 a on the first passivation layer 8 a. The material of the first passivation layer 8 a and the material of the second passivation layer 9 a may be the same or different. The second passivation layer 9 a is also referred as a post-passivation layer, and is optionally formed.

The conductive posts 19 a are formed on and electrically connected to the pads 14 a exposed by the passivation layer 15 a. In some embodiments, the conductive post 19 includes a first portion 16 a and a second portion 17 a. The first portion 16 a is embedded in and laterally covered by the passivation layer 15 a. The second portion 17 a is on the first portion 16 a and the passivation layer 15 a. In some embodiments, the second portion 17 a covers a portion of the top surface of the passivation layer 15 a. In some other embodiments, the second portion 17 a is on the first portion 16 a and does not cover the top surface of the passivation layer 15 a. The second portion 17 a is also referred as a connector. The conductive posts 19 a include solder bumps, gold bumps, copper bumps, copper posts, copper pillars, or the like. The protection layer 18 a is formed over the passivation layer 15 a and aside the connectors 17 a to cover the sidewalls of the connectors 17 a. The passivation layer 15 a and the protection layer 18 a respectively include an insulating material such as silicon oxide, silicon nitride, polymer, or a combination thereof. The polymer includes polybenzoxazole (PBO), polyimide (PI), benzocyclobutene (BCB), a combination thereof or the like, for example. In some embodiments, the passivation layer 15 a and the protection layer 18 a are free of fillers. The materials of the passivation layer 15 a and the protection layer 18 a may be the same or different. In some embodiments, the top surface of the protection layer 18 a is substantially level with the top surface of the connectors 17 a.

Similar to the die 120 a, the die 20 b includes a substrate 13 b, a pad 14 b, a passivation layer 15 b, and a conductive post 19 b. In some embodiments, the passivation layer 15 b includes a first passivation layer 8 b and a second passivation layer 9 b. The second passivation layer 9 b is also referred as a post-passivation layer and is optionally formed. The conductive post 19 b includes a first portion 16 b and a second portion 17 b. The second portion 17 b is also refereed as a connector. The material and the structural characteristics of the substrate 13 b, the pad 14 b, the passivation layer 15 b, and the conductive post 19 b of the die 20 b are substantially the same as or different from those of the substrate 13 a, the pad 14 a, the passivation layer 15 a, the conductive post 19 a of the die 120 a. The die 20 b differs from the die 120 a in that, no protection layer is formed aside the connectors 17 b. That is to say, the sidewalls of the connectors 17 b are not covered by a protection layer, but exposed. In some embodiments, the top surfaces of the connectors 17 a and the top surfaces of the connectors 17 b are substantially coplanar with each other, but the disclosure is not limited thereto. In some other embodiments, the top surfaces of the connectors 17 a and the top surfaces of the connectors 17 b may be not coplanar with each other.

In some embodiments, the dies 120 a and 20 b respectively has a first sidewall 40 a and a second sidewall 40 b opposite to each other. The first sidewall 40 a of the die 120 a or 20 b is the sidewall adjacent to another die 20 b or 120 a, and the second sidewall 40 b of the die 120 a or 20 b is the sidewall far away from another die 20 b or 120 a. The first sidewalls 40 a and the second sidewalls 40 b may be straight or inclined.

Referring to FIG. 1B, a first encapsulant material layer 22 is formed over the carrier 10 and on the die 20 b. The first encapsulant material layer 22 fills in the gap 21 between the die 120 a and the die 20 b, at least encapsulates the first sidewalls 40 a of the dies 120 a and 20 b, the top surfaces and sidewalls of the connectors 17 b of the die 20 b, and a portion of top surface of the passivation layer 15 b of the die 20 b. In some embodiments, the top surface of the passivation layer 15 b is completely covered by the first encapsulant material layer 22, but the disclosure is not limited thereto. In some other embodiments, a portion of the top surface of the passivation layer 15 b at an edge (the edge adjacent to the second sidewall 40 b) of the die 20 b may be not covered by the first encapsulant material layer 22 (shown as the dotted line A). In some embodiments, the top surface of the die 120 a, and the second sidewall 40 b of the die 20 b are not covered by the first encapsulant material layer 22, but the disclosure is not limited thereto. In some other embodiments, the first encapsulant material layer 22 may further extend to cover the top surface of the die 120 a or/and the sidewall 40 b of the die 20 b (shown as dotted line B).

In some embodiments, the first encapsulant material layer 22 is formed of an underfill material, a molding underfill material, polymer, or a combination thereof. The polymer includes polybenzoxazole (PBO), polyimide (PI), benzocyclobutene (BCB), a combination thereof or the like. Referring to the enlarged view of the first encapsulant material layer 22, in some embodiments in which the first encapsulant material layer 22 is formed of underfill material or molding underfill material, the first encapsulant material layer 22 includes polymer and a plurality of fillers 22′. The filler 22′ may be a powdered inorganic material, the filler 22′ may be a single element, a compound such as nitride, or a combination thereof, e.g., silica, alumina, carbon, or aluminum nitride, or mixtures thereof. In some embodiments, the filler 22′ is fine filler whose particle size is very small. The average particle size of the filler 22′ ranges from 0.1 μm to 10 μm, or even smaller than 0.1 μm, for example. In some other embodiments, the first encapsulant material layer 22 may be free of filler. The first encapsulant material layer 22 may be formed by a dispensing process, for example. In some embodiments, after the first encapsulant material layer 22 is dispensed in the gap 21 and on the die 20 b, a curing process is further performed.

Still referring to FIG. 1B, in some embodiments, the surface of the first encapsulant material layer 22 is unflat. The first encapsulant material layer 22 may be tapered towards the die 20 b. The surface of the first encapsulant material layer 22 may have a curved profile, an inclined profile, an arced profile, or a combination thereof. In some embodiments, the surface of the first encapsulant material layer 22 is higher than the top surface of the protection layer 18 a of the die 120 a.

Referring to FIG. 1C, a second encapsulant material layer 23 is formed over the carrier 10 and the dies 120 a and 20 b, so as to encapsulate the second sidewalls 40 b of the dies 120 a and 20 b, the top surface of the die 120 a and the top surface of the first encapsulant material layer 22. The material of the second encapsulant material layer 23 may be the same as or different from the material of the first encapsulant material layer 22. In some embodiments, the first encapsulant material layer 22 and the second encapsulant material layer 23 comprise the same material with different physical characteristics (e.g. particle size). The second encapsulant material layer 23 includes a molding compound, for example. In some embodiments, the second encapsulant material layer 23 is formed by a process different from that of the first encapsulant material layer 22, such as a molding process.

Referring to the enlarged view of the first encapsulant material layer 22 and the second encapsulant material layer 23, in some embodiments, the second encapsulant material layer 23 is a composite material including a polymer and a plurality of fillers 23′. The filler 23′ may be a single element, a compound such as nitride, oxide, or a combination thereof. The fillers 23′ may comprise silicon oxide, aluminum oxide, boron nitride, alumina, silica, and the like, for example. The cross-section shape of the filler 22′ or 23′ may be circle, square, rectangle, or any other shape, and the disclosure is not limited thereto. In some embodiments, the particle size of the filler 23′ is larger than the particle size of the filler 22′, herein, the particle size of the filler 22′ or 23′ refers to the diameter, length, width or height of the filler 22′ or 23′. The average particle size of the filler 23′ ranges from 3 μm to 30 μm, or even larger than 30 μm, for example. In some embodiments, the particle size is referred to the average particle size D50, and the average particle size D50 of the filler 23′ is larger than the average particle size D50 of the filler 22′.

Referring to FIG. 1C and FIG. 1D, a planarization process is performed, and a portion of the second encapsulant material layer 23 and a portion of the first encapsulant material layer 22 are removed, such that the connectors 17 a of the die 120 a and the connectors 17 b of the die 20 b are exposed, and a first encapsulant 22 a and a second encapsulant 23 a are formed. In some embodiments in which the top surfaces of the connectors 17 a and the top surfaces of the connectors 17 b are not coplanar with each other, ones of the connectors 17 a and the connectors 17 b at a higher level are removed during the planarization process, that is, portions of the connectors 17 a and a portion of the protection layer 18 a, or portions of the connectors 17 b are also removed during the planarization process. In some embodiments, after the planarization process, the top surfaces of the connectors 17 a and the protection layer 18 a of the die 120 a, the top surfaces of the connectors 17 b of the die 20 b, the top surface of the first encapsulant 22 a, and the top surface of the second encapsulant 23 a are substantially coplanar with each other. The planarization process includes a grinding process or a polishing process, such as a chemical mechanical polishing (CMP) process. After the planarization process, as the first encapsulant 22 a is formed of materials free of filler or including fine fillers, the first encapsulant 22 a may have a substantially flat surface, and the problem of rounghness surface or pits may be caused by large fillers is avoided. In some embodiments in which the second encapsulant 23 a includes fillers having larger particle size than the first encapsulant 22 a, the top surface of the first encapsulant 22 a is more flat than the top surface of the second encapsulant 23 a.

Referring to FIG. 1D, in some embodiments, the first encapsulant 22 a is disposed in the gap 21 between the dies 120 a and 20 b, and on the passivation layer 15 b of the die 20 b, encapsulating the first sidewalls 40 a of the dies 120 a and 20 b, and sidewalls of the connectors 17 b. That is to say, the connectors 17 b of the die 20 b are laterally covered by and in contact with the first encapsulant 22 a. The second encapsulant 23 a is aside and laterally encapsulants the sidewall of the first encapsulant 22 a, and the second sidewalls of the dies 120 a and 20 b.

Still referring to FIG. 1D, an interface 24 is existed between the first encapsulant 22 a and the second encapsulant 23 a. The interface 24 is on an edge of the die 20 b. In some embodiments, the interface 24 is connected to the second sidewall 40 b of the die 20 b. The interface 24 and the second sidewall 40 b may be not coplanar. In some other embodiments, the interface 24 is not connected to the second sidewall 40 b of the die 20 b (shown as the dotted line A′). The profile of the interface 24 is inclined, curved, or arced, for example.

Interfaces also exist between the protection layer 18 a and the first encapsulant 22 a, and between the protection layer 18 a and the second encapsulant 23 a. In some embodiments, the interface between the protection layer 18 a and the first encapsulant 22 a and the interface between the protection layer 18 a and the second encapsulant 23 a may respectively be straight or inclined.

Referring to FIG. 1E, a redistribution layer (RDL) structure 26 is formed over and electrically connected to the dies 120 a and 20 b. In some embodiments, the die 120 a and the die 20 b are electrically connected to each other through the RDL structure 26. In some embodiments, the RDL structure 26 is referred as a “front-side redistribution layer structure”, wherein the “front-side” refers to a side close to the connectors 17 a and 17 b of the dies 120 a and 20 b. In some embodiments, the RDL structure 26 includes a plurality of polymer layers PM1, PM2, PM3 and PM4 and a plurality of redistribution layers RDL1, RDL2, RDL3 and RDL4 stacked alternately. The number of the polymer layers or the redistribution layers is not limited by the disclosure.

The redistribution layer RDL1 penetrates through the polymer layer PM1 and is electrically connected to the connectors 17 a and 17 b of the dies 120 a and 20 b. The redistribution layer RDL2 penetrates through the polymer layer PM2 and is electrically connected to the redistribution layer RDL1. The redistribution layer RDL3 penetrates through the polymer layer PM3 and is electrically connected to the redistribution layer RDL2. The redistribution layer RDL4 penetrates through the polymer layer PM4 and is electrically connected to the redistribution layer RDL3.

The material of the polymer layer PM1, PM2, PM3, PM4 may be the same as or different from the material of the protection layer 18 a of the die 120 a, the material of the first encapsulant 22 a or the material of the second encapsulant 23 a. In some embodiments, each of the polymer layers PM1, PM2, PM3 and PM4 includes a photo-sensitive material such as polybenzoxazole (PBO), polyimide (PI), benzocyclobutene (BCB), a combination thereof or the like. In some embodiments, the protection layer 18 a is referred as a polymer layer PM0.

In some embodiments, each of the redistribution layers RDL1, RDL2, RDL3 and RDL4 includes conductive materials. The conductive materials includes metal such as copper, nickel, titanium, a combination thereof or the like, and is formed by an electroplating process. In some embodiments, the redistribution layers RDL1, RDL2, RDL3 and RDL4 respectively includes a seed layer (not shown) and a metal layer formed thereon (not shown). The seed layer may be a metal seed layer such as a copper seed layer. In some embodiments, the seed layer includes a first metal layer such as a titanium layer and a second metal layer such as a copper layer over the first metal layer. The metal layer may be copper or other suitable metals.

In some embodiments, the redistribution layers RDL1, RDL2, RDL3 and RDL4 respectively includes a plurality of vias V and a plurality of traces T connected to each other. The vias V vertically penetrate through the polymer layers PM1, PM2, PM3 and PM4 to connect the traces T of the redistribution layers RDL1, RDL2, RDL3 and RDL 4, and the traces T are respectively located on the polymer layers PM1, PM2, PM3 and PM 4, and are respectively horizontally extending on the top surface of the polymer layers PM1, PM2, PM3 and PM4.

In some embodiments, the traces T of the redistribution layers RDL1, especially the traces T1 connecting the die 120 a and the die 20 b, are routing over the first encapsulant 22 a and the protection layer 18 a, and not over the second encapsulant 23 a. As the top surface of the first encapsulant 22 a is relatively more flat than the top surface of the second encapsulant 23 a, therefore, the traces T or T1 on the first encapsulant 22 a may achieve a fine quality, and the trace broken (open) or bridge (short) issues may occur due to the roughness of the encapsulant is avoided.

In some embodiments, the redistribution layer RDL4 is the topmost redistribution layer of the RDL structure 26, and is referred as an under-ball metallurgy (UBM) layer for ball mounting.

Still referring to FIG. 1E, thereafter, a plurality of connectors 27 are formed over and electrically connected to the redistribution layer RDL4 of the RDL structure 26. In some embodiments, the connectors 27 are referred as conductive terminals. In some embodiments, the connectors 27 may be ball grid array (BGA) connectors, solder balls, controlled collapse chip connection (C4) bumps, or a combination thereof. In some embodiments, the material of the connector 27 includes copper, aluminum, lead-free alloys (e.g., gold, tin, silver, aluminum, or copper alloys) or lead alloys (e.g., lead-tin alloys). The connector 27 may be formed by a suitable process such as evaporation, plating, ball dropping, screen printing and reflow process, a ball mounting process or a C4 process. In some embodiments, metal posts or metal pillars may further be formed between the redistribution layer RDL4 and the connectors 27 (not shown). The connectors 27 are electrically connected to the two dies 120 a and 20 b through the RDL structure 26.

Referring to FIG. 1E and FIG. 1F, the de-bonding layer 11 is decomposed under the heat of light, and the carrier 10 is then released. In some embodiments, the adhesive layer 12 is then removed by, for example, a cleaning process. The bottom surfaces (or referred as back surfaces) of the dies 120 a and 20 b, that is, the bottom surfaces of the substrates 13 a and 13 b are exposed.

Referring to FIG. 1F, a package structure 50 a is thus completed. The package structure 50 a is also referred as a fan-out package structure. The package structure 50 a includes the two dies 120 a and 20 b, the first encapsulant 22 a, the second encapsulant 23 a, the RDL structure 26 and the connectors 27. The die 120 a and the die 20 b are connected through the RDL structure 26.

In some embodiments, the first encapsulant 22 a is located between the die 120 a and the die 20 b, and on the die 20 b. The first encapsulant 22 a at least encapsulates the first sidewall 40 a of the die 120 a, the first sidewall 40 a of the die 20 b, the sidewalls of the connectors 27 of the die 20 b, and a portion of the top surface of the passivation layer 15 b of the die 20 b. In some embodiments, the cross-section shape of the portion of the first encapsulant 22 a under the trace T1 is reversed L-shaped, for example. In some embodiments, the sidewalls of the portion of the first encapsulant 22 a between the two dies 120 a and 13 b are straight or inclined. The sidewall of the first encapsulant 22 a on the edge of the die 20 b is inclined, curved, or arced.

In some embodiments, the second encapsulant 23 a is aside and encapsulates the sidewall of the first encapsulant 22 a, aside and encapsulates the second sidewalls 40 b of the dies 120 a and 20 b.

The connectors 17 a of the die 120 a are laterally covered by and in contact with the protection layer 18 a, and are separated from the first encapsulant 22 a. The protection layer 18 a of the die 120 a is in contact with the first encapsulant 22 a at the first sidewall 40 a of the die 120 a, and in contact with the second encapsulant 23 a at the second sidewall 40 b of the die 120 a. The connectors 17 b of the die 20 b are laterally covered by and in contact with the first encapsulant 22 a, and separated from the second encapsulant 23 a.

The corner θ1 of the die 20 b is covered by and in contact with the first encapsulant 22 a. The corner θ2 of the die 20 b is covered by and in contact with the first encapsulant 22 a or/and the second encapsulant 23 a. The corner β1 of the die 120 a is covered by and in contact with the protection layer 18 a and the first encapsulant 22 a. The corner β2 of the die 120 a is covered by and in contact with the protection layer 18 a and the second encapsulant 23 a. Herein, the corners θ1 and θ2 are referred to the corners of the passivation layer 15 b of the die 20 b, the corners β1 and β2 are referred to the corners of the passivation layer 15 b of the die 20 b.

In some embodiments, the interface 24 includes two end points 24 a and 24 b. The end point 24 a is in contact with the polymer layer PM1 of the RDL structure 26, and at the same plane as the top surfaces of the connectors 17 a/17 b. The end point 24 b is on the edge of the die 20 b and is in contact with the protection layer 15 b. In some embodiments, the end point 24 b is on the top surface of the protection layer 15 b, and away from the second sidewall 40 b of the die 20 b. In some embodiments, the end point 24 b is at the intersection point of the top surface of the passivation layer 15 b and the second sidewall 40 b of the die 20 b. In some embodiments, an included angle a between the interface 24 and the top surface of the passivation layer 15 b is less than 90°. In other words, the interface 24 is inclined towards the connector 17 a of the die 20 b. A portion of the second encapsulant 23 a is located over the die 20 b.

In some embodiments in which the interface 24 is connected to the second sidewall 40 b of the die 20 b, the top surface of the passivation layer 15 b of the die 20 b is covered by the first encapsulant 22 a, and is not in contact with the second encapsulant 23 a. However, the disclosure is not limited thereto. In some other embodiments in which the interface 24 is not connected to the second sidewall 40 b of the die 20 b (shown as the dotted line A′), a portion of the top surface of the passivation layer 15 b adjacent to the corner θ2 is not covered by the first encapsulant 22 a, but is covered by the second encapsulant 23 a.

In some embodiments, the package structure 50 a may further be electrically coupled to other package components such as a printed circuit board (PCB), a flex PCB, or the like through the connectors 27.

Referring to FIG. 4, in some embodiments in which the first encapsulant material layer 22 further extends to cover the second sidewall 40 b of the die 20 b, a package structure 50 b is formed. The package structure 50 b is similar to the package structure 50 a, but differs from the package structure 50 a in that the first encapsulant 22 a further extends to cover the second sidewall 40 b of the die 20 b, and the other structural characteristics of package structure 50 b are substantially the same as those of the package structure 50 a.

Still referring to FIG. 4, in the package structure 50 b, the first encapsulant 22 a encapsulates the first sidewall 40 a of the die 120 a, the first sidewall 40 a and the second sidewall 40 b of the die 20 b, the sidewalls of the connectors 17 b of the die 20 b, and the top surface of the passivation layer 15 a of the die 20 b. The interface 24′ between the first encapsulant 22 a and the second encapsulant 23 a is over the edge of the die 20 b, and aside the second sidewall 40 b of the die 20 b. The interface 24′ is not connected to the second sidewall 40 b of the die 20 b. In some embodiments, the interface 24′ is not in contact with the passivation layer 15 b of the die 20 b. The interface 24′ includes two end points 24 a′ and 24 b′. The interface 24′ differs from the interface 24 in that the end point 24 b′ is aside the second sidewall 40 b of the die 20 b, and at a same plane as the bottom surfaces of the dies 120 a and 20 b.

In some embodiments, the first sidewall 40 a, the second sidewall 40 b and the corners 01 and θ2 of the die 20 b are covered and in contact with the first encapsulant 22 a, and are not in contact with the second encapsulant 23 a. The second sidewall 40 b and the corner θ2 of the die 20 b are separated from the second encapsulant 23 a by the first encapsulant 22 a therebetween. The structural relationship between the die 120 a and the encapsulants 22 a and 23 a are substantially the same as those of the package structure 50 a (FIG. 1F), which is not described again.

FIG. 2A to FIG. 2F are schematic cross-sectional views illustrating a forming method of a package structure according to a second embodiment of the disclosure. The second embodiment is similar to the first embodiment, but differs from the first embodiment in that, the sidewalls of the connectors 17 a of the die 20 a are not surrounded by a protection layer, but encapsulated by a first encapsulant 122 a.

Referring to FIG. 2A, processes similar to those of the first embodiment are performed, a de-bonding layer 11 is formed on a carrier 10, a first die 20 a and a second die 20 b are attached to the de-bonding layer 11 over the carrier 10 through an adhesive layer 12. A gap 21 is existed between the die 20 a and the die 20 b. In this embodiment, both the connectors 17 a of the die 20 a and the connectors 17 b of the die 20 b are not surrounded by a protection layer, that is to say, the sidewalls of the connectors 17 a and 17 b and the top surface of the passivation layer 15 a and 15 b are exposed. The other features of the die 20 a and the die 20 b are substantially the same as those of the die 120 a and the die 20 b in the first embodiment.

Referring to FIG. 2B, a first encapsulant material layer 122 is formed on the dies 20 a and 20 b, and fills in the gap 21 between the dies 20 a and 20 b. In some embodiments, the first encapsulant material layer 122 at least encapsulates the first sidewalls 40 a of the dies 20 a and 20b, portions of the top surfaces of the passivation layer 15 a and 15 b, the sidewalls and the top surfaces of the connectors 17 a and 17 b. The material and the forming method of the first encapsulant material layer 122 are substantially the same as those of the first encapsulant material layer 22 in the first embodiment. In some embodiment, the surface of first encapsulant material layer 122 is unflat, and may have an inclined, a curved or an arced profile, for example.

In some embodiments, the top surfaces of the passivation layer 15 a and 15 b are completely covered by the first encapsulant material layer 122, but the disclosure is not limited thereto. In some other embodiments, portions of the top surfaces of the passivation layer 15 a and 15 b on the edge (the edge adjacent to the second sidewalls 40 b) of the dies 20 a and 20 b may be not covered by the first encapsulant material layer 122, but exposed (shown as the dotted line C).

In some embodiments, the second sidewalls 40 b of the dies 20 a and 20 b are not covered by the first encapsulant material layer 22, and are exposed. However, the disclosure is not limited thereto. In some other embodiments, the first encapsulant material layer 122 may further extend to encapsulate the second sidewalls 40 b of the dies 20 a and 20 b (shown as the dotted line D).

Referring to FIG. 2C, a second encapsulant material layer 123 is formed on the carrier 10 and on the first encapsulant material layer 122. In some embodiments, the second encapsulant material layer 123 encapsulates the second sidewalls 40 b of the dies 20 a and 20 b and the top surface of the first encapsulant material layer 122. The material and the forming method of the second encapsulant material layer 123 are substantially the same as those of the second encapsulant material layer 23 in the first embodiment.

Referring to FIG. 2C and FIG. 2D, a planarization process is performed, and a portion of the second encapsulant material layer 123 and a portion of the first encapsulant material layer 122 are removed, such that the connectors 17 a of the die 20 a and the connectors 17 b of the die 20 b are exposed, and a first encapsulant 122 a and a second encapsulant 123 a are formed. In some embodiments, the top surfaces of the connectors 17 a and 17 b, the top surface of the first encapsulant 122, and the top surface of the second encapsulant 123 are substantially coplanar with each other.

Referring to FIG. 2E and FIG. 2F, processes similar to those described in FIG. lE and FIG. 1F are performed, a RDL structure 26 is formed on the dies 20 a and 20 b, on the first encapsulant 122 a and the second encapsulant 123 a. The RDL structure 26 includes polymer layers PM1, PM2, PM3, PM4 and redistribution layers RDL1, RDL2, RDL3, RDL4. A plurality of connectors 27 are formed on the redistribution layer RDL4 of the RDL structure 26. The connectors 27 are electrically connected to the dies 20 a and 20 b through the RDL structure 26.

Thereafter, the de-bonding layer 11 is decomposed under the heat of light, and the carrier 10 is then released. In some embodiments, the adhesive layer 12 is removed by, for example, a cleaning process. The bottom surfaces (or referred as back surfaces) of the dies 20 a and 20 b are exposed.

Referring to FIG. 2F, a package structure 150 a is thus completed. The package structure 150 a includes the two dies 20 a and 20 b, the first encapsulant 122 a, the second encapsulant 123 a, the RDL structure 26 and the connectors 27. In some embodiments, the die 20 a and the die 20 b are electrically connected to each other through the RDL structure 26.

The first encapsulant 122 a is located between the die 20 a and the die 20 b, and on the dies 20 a and 20 b. The first encapsulant 122 a at least encapsulates and contacts with the first sidewalls 40 a of the dies 20 a and 20 b, the sidewalls of the connectors 17 a and 17 b, and portions of the top surfaces of the passivation layer 15 a and 15 b. The top surface of the first encapsulant 122 a is in contact with the bottom surface of the polymer layer PM1. In some embodiments, the cross-section shape of the portion of the first encapsulant 122 a under the trace T1 of the RDL1 is T-shaped. In some embodiments, the sidewalls of the first encapsulant 122 a are inclined, curved, or arced.

The second encapsulant 123 a is located aside and encapsulates the second sidewalls 40 b of the dies 20 a and 20 b and the sidewalls of the first encapsulant 122 a.

An interface 124 is existed between the first encapsulant 122 a and the second encapsulant 123 a. The interface 124 includes a first interface 124 a and a second interface 124 b. The interface 124 a is on an edge (the edge adjacent to the corner β2) of the die 120 a. In some embodiments, the first interface 124 a is connected to the second sidewall 40 b of the die 20 a. In some other embodiments, the first interface 124 a is not connected to the second sidewall 40 b of the die 20 a (shown as the dotted line C′). The interface 124 b is on an edge (the edge adjacent to the corner θ2) of the die 20 b. In some embodiments, the second interface 124 b is connected to the second sidewall 40 b of the die 20 b. In some other embodiments, the interface 124 b is not connected to the second sidewall 40 b of the die 20 b (shown as the dotted line). In some embodiments, the first interface 124 a and the second interface 124 b are symmetrical to each other, but the disclosure is not limited thereto. The structural characteristics of the first interface 124 a and the second interface 124 b are respectively similar to those of the interface 24 shown in FIG. 1F, and is not described again.

The connectors 17 a of the die 20 a and the connectors 17 b of the die 20 b are laterally covered by and in contact with the first encapsulant 122 a, and are separated from the second encapsulant 123 a. The corner β1 of the die 20 a and the corner θ1 of the die 20 b are covered by and in contact with the first encapsulant 122 a. The corner β2 of the die 20 a and the corner θ2 of the die 20 b are covered by and in contact with the first encapsulant 122 a or/and the second encapsulant 123 a. In some embodiments in which the interface 124 is on the edges of the dies 20 a and 20 b, and not connected to the second sidewalls 40 b of the dies 20 a and 20 b (shown as the dotted line C′), the corner β2 of the die 20 a and the corner θ2 of the die 20 b are covered by the second encapsulant 123 a.

In some embodiments, the top surfaces of passivation layer 15 a and the passivation layer 15 b are covered by the first encapsulant 122 a, and are not in contact with the second encapsulant 123 a, but the disclosure is not limited thereto. In some other embodiments, a portion of the top surface of the passivation layer 15 a adjacent to the corner β2 of the die 20 a, and a portion of the top surface of the passivation layer 15 b adjacent to the corner θ2 of the die 20 b are not covered by the first encapsulant 122 a, but covered by the second encapsulant 123 a (shown as the dotted line C′).

Thereafter, the package structure 150 a may further be electrically coupled to other package components such as a printed circuit board (PCB), a flex PCB, or the like through the connectors 27.

Referring to FIG. 5, in some embodiments in which the first encapsulant material layer 122 further extend to encapsulate the second sidewalls 40 b of the dies 20 a and 20 b, a package structure 150 b is formed. The package structure 150 b is similar to the package structure 150 a, but differs from the package structure 150 a in that the first encapsulant 122 a further extends to cover the second sidewalls 40 b of the dies 20 a and 20 b, and the other structural characteristics of the package structure 150 b are substantially the same as those of the package structure 150 a.

Still referring to FIG. 5, in the package structure 150 b, the first encapsulant 122 a laterally encapsulates and contacts with the first sidewalls 40 a and the second sidewalls 40 b of the dies 20 a and 20 b, and is on the dies 20 a and 20 b, encapsulating and contacting with the sidewalls of the connectors 17 a and 17 b, and the top surfaces of the passivation layers 15 a and 15 b of the die 20 a.

The second encapsulant 123 a is located aside the first encapsulant 122 a, encapsulating the sidewalls of the first encapsulant 122 a. The second encapsulant 123 a is not in contact with the second sidewalls 40 b of the dies 20 a/20 b, but separated from the dies 20 a/20 b by the first encapsulant 122 a therebetween.

The interface 124′ between the first encapsulant 122 a and the encapsulant 123 a is not in contact with the edge of the dies 20 a and 20 b, or connected to the second sidewalls 40 b of the dies 20 a and 20 b. Instead, portions of the interface 124′ are located aside the second sidewalls 40 b of the dies 20 a and 20 b. The interface 124′ includes a first interface 124 a′ aside the second sidewall 40 b of the die 20 a, and a second interface 124 b′ aside the second sidewall 40 b of the die 20 b. In some embodiments, the first interface 124 a′ and the second interface 124 b′ are symmetrical to each other, but the disclosure is not limited thereto. The structural characteristics of the first interface 124 a′ and the second interface 124 b′ are respectively similar to those of the interface 24′ shown in FIG. 4, and is not described again.

FIG. 3A to FIG. 3F are schematic cross-sectional views illustrating a forming method of a package structure according to a third embodiment of the disclosure. The third embodiment is similar to the foregoing embodiments, but differs from the foregoing embodiments in that, the sidewalls of the connectors 17 a are surrounded by and in contact with a protection layer 18 a of a die 120 a, and the sidewalls of the connectors 17 b are surrounded by and in contact with a protection layer 18 b of a die 120 b.

Referring to FIG. 3A, processes similar to those described in FIG. 1A are performed, a de-bonding layer 11 is formed on a carrier 10, a die 120 a and a die 120 b are attached to the de-bonding 11 through an adhesive layer 12. The structural characteristics of the die 120 a are substantially the same as those of the die 120 a in the first embodiment. The die 120 b differs from the die 20 b in that, the die 120 further includes a protection layer 18 b. The protection layer 18 b is formed on the passivation layer 15 b, and aside the connectors 17 b, surrounding and covering the sidewalls of the connectors 17 b. In some embodiments, the top surface of the protection layer 18 b and the top surfaces of the connectors 17 b are substantially coplanar with each other. A gap 21 is existed between the die 120 a and the die 120 b.

Referring to FIG. 3B and FIG. 3C, a first encapsulant material layer 222 is formed to fill the gap 21 between the die 120 a and the die 120 b. The first encapsulant material layer 222 at least encapsulates the first sidewalls 40 a of the dies 120 a and 120 b. In some embodiments, the first encapsulant material layer 222 may protrudes from the top surfaces of the dies 120 a and 120 b. In some embodiments, the first encapsulant material layer 222 may further cover a portion of the top surface of the die 120 a or/and a portion of the top surface of the die 120 b.

A second encapsulant material layer 223 is formed on the carrier 10, the dies 120 a and 120 b, and the first encapsulant material layer 222. The materials and the forming methods of the first encapsulant material layer 222 and the second encapsulant material layer 223 are substantially the same as those of the first encapsulant material layer 22 and the second encapsulant material layer 23 described in the first embodiment, respectively.

Referring to FIG. 3C and FIG. 3D, a planarization process is performed, and a portion of the first encapsulant material layer 222 and a portion of the second encapsulant material layer 223 are removed, such that the top surfaces of the connectors 17 a and the connectors 17 b are exposed, a first encapsulant 222 a and a second encapsulant 223 a are formed.

Referring to FIG. 3E and FIG. 3F, thereafter, a RDL structure 26 and a plurality of connectors 27 are formed on the dies 120 a and 120 b, the first encapsulant 222 a and the second encapsulant 223 a. The die 120 a and the die 120 b are electrically connected to each other through the RDL structure 26. The connectors 27 are electrically connected to the dies 120 a and 120 b through the RDL structure 26.

The de-bonding layer 11 is decomposed under the heat of light, and the carrier 10 is then released. In some embodiments, the adhesive layer 12 is removed. The bottom surfaces (or referred as back surfaces) of the dies 120 a and 120 b are exposed.

Referring to FIG. 3F, a package structure 250 is thus completed. The package structure 250 includes the two dies 120 a and 120 b, the first encapsulant 222 a, the second encapsulant 223a, the RDL structure 26 and the connectors 27.

The first encapsulant 222 a is located between the die 120 a and the die 120 b, that is, aside the first sidewalls 40 a of the dies 120 a and 120 b, encapsulating and contacting with the first sidewalls 40 a of the dies 120 a and 120 b. In some embodiments, the cross-section shape of the first encapsulant 222 a includes I-shape, rectangle, square, or a combination thereof. The second encapsulant 223 a is located aside, encapsulates and contacts with the second sidewalls 40 b of the dies 120 a and 120 b. In this embodiment, the first encapsulant 222 a and the second encapsulant 223 a are not in contact with each other. The connectors 17 a and 17 b are not in contact with the first encapsulant 222 a or the second encapsulant 223 a, but are respectively surrounded by and in contact with the protection layers 18 a and 18 b. Interfaces are existed between the protection layer 18 a/18 b and the first encapsulant 222 a or between the protection layer 18 a/18 b and the second encapsulant 223 a, and the interfaces may be straight or inclined.

Thereafter, the package structure 250 may further be electrically coupled to other package components such as a printed circuit board (PCB), a flex PCB, or the like through the connectors 27.

FIG. 6 is a flow chart illustrating a method of forming a package structure according to some embodiments of the disclosure. Referring to FIG. 6, in step S10, a first encapsulant is formed at least between a first die and a second die. In step S12, a second encapsulant is formed aside a sidewall of the first die and a sidewall of the second die. In step S14, a redistribution layer (RDL) structure is formed on the first die, the second die, the first encapsulant, and the second encapsulant. In step S16, a plurality of conductive terminals are electrically connected to the first die and the second die through the RDL structure.

In the foregoing embodiments, package structure including two dies and method of manufacturing the same are illustrated. However, the disclosure is not limited thereto, the disclosure may also applied to single die package structure including one die or multiple die package structure including more than two dies.

In the embodiments of the disclosure, the encapsulant including a first encapsulant and a second encapsulant aside the dies are formed of two different materials by two step processes. The first encapsulant is formed at least aside the first sidewalls of the two dies, the second encapsulant is formed aside the second sidewalls of the two dies. The first encapsulant is formed of a material comprising fine fillers or no filler. Therefore, the problem of roughness surface or even pits may be caused by large filler are avoided. On the other hand, the first encapsulant is formed at least between the two dies, especially under the traces connecting the two dies. In other words, the traces of the bottommost redistribution layer are routing over the first encapsulant or/and the protection layer of the die in which no filler or fine filler is included. Therefore, the traces may achieve a fine quality, and the trace broken (open) and bridge (short) issues may occur due to the roughness of the encapsulant is avoided.

In accordance with some embodiments of the disclosure, a package structure includes a first die and a second die, a first encapsulant, a second encapsulant and a RDL structure. The first die includes a first connector and a first protection layer covering sidewalls of the first connector, and the second die includes a second connector. The first encapsulant is at least disposed laterally between the first die and the second die to encapsulate first sidewalls of the first die and the second die that faces each other. The second encapsulant encapsulates second sidewalls of the first die and the second die. The RDL structure is disposed on and electrically connected to the first die and the second die. The top surfaces of the first protection layer, the first encapsulant, and the second encapsulant are in contact with a bottom surface of the RDL structure.

In accordance with alternative embodiments of the disclosure, a package structure includes a first die and a second die, a first encapsulant, a second encapsulant and a conductive terminal. The first die includes a first connector, and the second includes a second connector. The first encapsulant is laterally between the first die and the second die and on the second die. The first connector is separated from the first encapsulant by a protection layer of the first die, and the second connector of the second die is in contact with the first encapsulant. The second encapsulant laterally encapsulates the first die, the second die and the first encapsulant. The conductive terminal is electrically connected to the first die and the second die through a RDL structure.

In accordance with some embodiments of the disclosure, a method of forming a package structure includes: providing a first die and a second die, wherein the first die comprises a first connector and a first protection layer covering sidewalls of the first connector, and the second die comprises a second connector; forming a first encapsulant at least between the first die and the second die; forming a second encapsulant to laterally encapsulate the first die and the second die, wherein the first encapsulant and the second encapsulant are formed by different processes; and forming a redistribution layer (RDL) structure on and electrically connected to the first die and the second die, wherein top surfaces of the first protection layer, the first encapsulant and the second encapsulant are in contact with a bottom surface of the RDL structure.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the disclosure. Those skilled in the art should appreciate that they may readily use the disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the disclosure. 

What is claimed is:
 1. A package structure, comprising: a first die and a second die, wherein the first die comprises a first connector and a first protection layer covering sidewalls of the first connector, the second die comprises a second connector; a first encapsulant, at least disposed laterally between the first die and the second die to encapsulate first sidewalls of the first die and the second die that faces each other; and a second encapsulant, encapsulating second sidewalls of the first die and the second die; and a redistribution layer (RDL) structure, disposed on and electrically connected to the first die and the second die, wherein top surfaces of the first protection layer, the first encapsulant and the second encapsulant are in contact with a bottom surface of the RDL structure.
 2. The package structure of claim 1, wherein sidewalls of the first protection layer are covered by and in physical contact with the first encapsulant and the second encapsulant.
 3. The package structure of claim 1, where the first encapsulant is further disposed to encapsulate sidewalls of the second connector of the second die.
 4. The package structure of claim 1, wherein the second die further comprises a second protection layer disposed to cover sidewalls of the second connector, and sidewalls of the second protection layer are covered by the first encapsulant and the second encapsulant.
 5. The package structure of claim 1, wherein the first connector of the first die is separated from the first encapsulant and the second encapsulant by the first protection layer.
 6. The package structure of claim 1, wherein interfaces are existed between the first protection layer and the first encapsulant, and between the first protection layer and the second encapsulant.
 7. The package structure of claim 1, wherein the first encapsulant and the second encapsulant comprise fillers, while the protection layer is free of fillers.
 8. The package structure of claim 1, wherein the first encapsulant and the second encapsulant comprise different materials.
 9. The package structure of claim 1, wherein the first encapsulant comprises a first filler, the second encapsulant comprises a second filler, and a particle size of the first filler is less than a particle size of the second filler.
 10. A package structure, comprising: a first die and a second die, wherein the first die comprises a first connector, and the second die comprises a second connector; a first encapsulant, laterally between the first die and the second die, and on the second die, wherein the first connector is separated from the first encapsulant by a protection layer of the first die, and the second connector of the second die is in contact with the first encapsulant; a second encapsulant, laterally encapsulating the first die, the second die and the first encapsulant; and a conductive terminal, electrically connected to the first die and the second die through a redistribution layer (RDL) structure.
 11. The package structure of claim 10, wherein a top surface of the protection layer of the first die is substantially coplanar with a top surface of the first encapsulant.
 12. The package structure of claim 10, wherein the RDL structure comprises a redistribution layer electrically connected to the first die and the second die, the redistribution layer comprises: a first via, landing on the first connector of the first die; a second via, landing on the second connector of the second die; and a trace, extending from the first via to the second via, wherein the trace is overlapped with the protection layer and the first encapsulant in a direction perpendicular to a top surface of the first die.
 13. The package structure of claim 10, wherein a portion of the second encapsulant is vertically sandwiched between the first encapsulant and the RDL structure.
 14. The package structure of claim 10, wherein a portion of first encapsulant further extends to be sandwiched between a sidewall of the second die and the second encapsulant.
 15. The package structure of claim 10, wherein an interface is existed between the first encapsulant and the second encapsulant.
 16. A method of forming a package structure, comprising: providing a first die and a second die, wherein the first die comprises a first connector and a first protection layer covering sidewalls of the first connector, and the second die comprises a second connector; forming a first encapsulant at least between the first die and the second die; forming a second encapsulant to laterally encapsulate the first die and the second die, wherein the first encapsulant and the second encapsulant are formed by different processes; and forming a redistribution layer (RDL) structure on and electrically connected to the first die and the second die, wherein top surfaces of the first protection layer, the first encapsulant and the second encapsulant are in contact with a bottom surface of the RDL structure.
 17. The method of claim 16, wherein forming the first encapsulant and the second encapsulant comprises: forming a first encapsulant material layer to fill a gap between the first die and the second die; forming a second encapsulant material layer to encapsulate the first die, the second die and the first encapsulant material layer; and performing a planarization process to remove excess portions of the first encapsulant material layer and the second encapsulant material layer, so as to expose the first connector and the first protection layer of the first die and the second connector of the second die.
 18. The method of claim 17, wherein the first encapsulant material layer is formed by a dispensing process, while the second encapsulant material layer is formed by a molding process.
 19. The method of claim 16, wherein the first encapsulant is further formed to encapsulate sidewalls of the second connector of the second die.
 20. The method of claim 16, wherein the second die further comprises a second protection layer covering sidewalls of the second connector, and the first encapsulant is formed to be laterally sandwiched between the first protection layer and the second protection layer. 